Transient-Liquid-Phase and Liquid-Film-Assisted Joining of Ceramics
نویسندگان
چکیده
منابع مشابه
Investigating the Joining of Ni3Al Intermetallic Compound, using Transient Liquid Phase (TLP) Method with Cu Interlayer
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ژورنال
عنوان ژورنال: Advances in Science and Technology
سال: 2006
ISSN: 1662-0356
DOI: 10.4028/www.scientific.net/ast.45.1568